| Product | Chip Quik Lead Free Solder Paste |
|---|---|
| Manufacturer | Chip Quik Inc. |
| Composition | <45% Modified Rosins; <5% Pine Oil Derivatives (Terpineol); <4% Mixed Carboxylic Acids (Maleic Acid); <5% Rheological Modifier; <4% Surfactants; Tin; Silver; Bismuth; Antimony; Indium; Copper |
| Synonyms | Paste, Solder Cream |
| Typical Uses | Electronics Soldering |
| Hazards |
 |
| Storage | Shelf 23 (electronics) |
| Disposal | Staff manage disposal of empty containers |
| Comments | |
| Status | AVAILABLE |
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Please contact a Garage staff member for uses not listed above.